Nowość

ECX-3000 AI

  • Przemysłowy Vecow ECX-3000 AI z Intel 14 gen, akceleratorem Hailo-8, 5x 2.5G LAN, zasilanie DC. Zakres temp. pracy: N/A, DC 9V do 50V, standardy: vPro, TPM 2.0.
  • ECX-3000 AI
  • ECX-3000 AI
  • ECX-3000 AI
  • ECX-3000 AI

Features

    • Workstation-grade Platform : Intel® Core™ i9/i7/i5/i3 Processor (14th gen, codename : RPL-S Refresh/RPL-S/ADL-S) running with Intel® R680E PCH supports max 65W TDP CPU
    • Intel® UHD Graphics 770 driven by Intel® Xe architecture with up to 32 graphics execution units (EUs) delivers immersive interactions with integrated graphics and accelerated AI performance
    • Compact Hailo-8™ AI Accelerator supports up to 26 Tera-Operations Per Second (TOPS) with best-in-class power efficiency of 3 TOPS/W
    • 5 Independent 2.5G LAN with 4 IEEE 802.3at PoE+
    • 4 Front-access M.2 SSD Tray, 6 USB 3.2 Gen 2
    • DC 9V to 50V Power Input, Software Ignition Control
    • Supports Intel® vPro, TCC, Time-Sensitive Networking (TSN), and TPM 2.0
    • Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications

     
Parametry techniczne:
System
System - Processor:
24-core Intel® Core™ i9/i7/i5/i3 Processor (14th gen, Raptor Lake-S Refresh)
,
24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
,
16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
System - Chipset:
Intel® R680E Chipset
System - BIOS:
AMI
System - SIO:
IT8786E
System - Memory:
2 DDR4 3200MHz SO-DIMM, up to 64GB
System - OS:
Windows 11, Windows 10, Linux
AI Accelerator
AI Accelerator - Processor:
Hailo-8™ AI Processor, up to 26 TOPS
AI Accelerator - Framework:
TensorFlow, ONNX
I/O Interface
I/O Interface - Serial:
Up to 4 COM RS-232/422/485
I/O Interface - USB:
6 USB 3.2 Gen 2
I/O Interface - Isolated DIO:
16 Isolated DIO : 8 DI, 8 DO (Optional)
I/O Interface - LED:
Power, HDD, PoE, Wireless
I/O Interface - SIM Card:
2 External SIM Card Sockets
I/O Interface - RTC Battery:
Front-access RTC Battery
Expansion
Expansion - Mini PCIe:
1 Mini PCIe Socket for PCIe/USB/SIM Card/Optional mSATA
Expansion - M.2:
- 1 M.2 Key B Socket (3042/3052, SATA/USB 3,  USB 2)
,
1 M.2 Key E Socket (2230, PCIe x2/USB)
Expansion - SUMIT A, B:
2 SUMIT Slot (Optional)
Graphics
Graphics - Graphics Processor:
Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture
Graphics - Interface:
4 independent displays : 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz
,
1 DVI-I : Up to 1920 x 1080 @60Hz
,
1 HDMI : Up to 1920×1080 @ 60Hz
Storage
Storage - SATA:
2 SATA III (6Gbps) support S/W RAID 0, 1
Storage - mSATA:
1 SATA III (Mini PCIe Type, 6Gbps)
Storage - Storage Device:
2 Front-access 2.5" SSD/HDD Tray
,
4 Front-access M.2 Key M SSD Tray (ECX-3000 PoES AI)
Audio
Audio - Audio Codec:
Realtek® ALC888S-VD, 7.1 Channel HD Audio
Audio - Audio Interface:
1 Mic-in, 1 Line-out
ETHERNET
Ethernet - LAN 1:
Intel® I219LM GigE LAN supports iAMT
Ethernet - LAN 2:
Intel® I226 2.5GigE LAN supports TSN
2.5G PoE
2.5G PoE - LAN 3:
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
2.5G PoE - LAN 4:
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
2.5G PoE - LAN 5:
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
2.5G PoE - LAN 6:
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226
Power
Power - Power Input:
DC 9V to 50V
Power - Power Interface:
3-pin Terminal Block : V+, V-, Frame Ground
,
4-pin Mini-DIN
Power - Ignition Control:
16-mode Software Ignition Control
Power - Remote Switch:
3-pin Terminal Block
Others
Others - TPM:
Infineon SLB9670 supports TPM 2.0, SPI Interface
Others - Watchdog Timer:
Reset : 1 to 255 sec./min. per step
Others - Smart Mgmt.:
Wake on LAN, PXE supported
Others - HW Monitor:
Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechaniczny
Mechanical - Dimension:
260.0mm x 175.0mm x 79.0mm (10.24" x 6.89" x 3.11")
Mechanical - Weight:
3.8 kg (8.38 lb)
Mechanical - Mounting:
Wallmount by mounting bracket
,
DIN Rail Mount (Optional)
,
2U Rackmount (Optional)
Środowisko
Environment - Operating Temperature:
35W TDP CPU :
,
-40°C to 65°C (-40°F to 149°F), Fanless
,
65W TDP CPU :
,
-40°C to 45°C (-40°F to 113°F), Fanless
,
ECX-3000-PoES AI : -40°C to 45°C (-40°F to 113°F), Fanless
Environment - Storage Temperature:
-40°C to 85°C (-40°F to 185°F)
Environment - Humidity:
5% to 95% Humidity, non-condensing
Environment - Relative Humidity:
95% @65°C
Environment - Shock:
IEC 60068-2-27
,
- SSD : 50G @wallmount, Half-sine, 11ms
Environment - Vibration:
IEC 60068-2-64
,
- SSD : 5Grms, 5Hz to 500Hz, 3 Axis
Environment - EMC:
CE, FCC, EN50155, EN50121-3-2

Jeśli potrzebujesz dodatkowych informacji zadzwoń do nas (22 831 10 42) lub napisz wiadomość. 

Gwarancja 24 miesiące - Gwarancja udzielana przez sprzedawcę na okres 24 miesięcy.

Gwarancja standardowa 24 miesiące

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