Moduł COM Express Basic Type 6 z Intel Core i3-3217UE 1.6 GHz, VGA/LVDS/3 x DDI, 1 x GbE, 4 x USB 3.0, 8 x USB 2.0, 2 x SATA-3 z RAID, 2 x SATA-2 z RAID i HD-audio (0 ~ +60°C) - pamięć ECC DDR3
Features
Features
- Dual-core 3rd Generation Intel Core i3 Processor with Mobile Intel QM77 Express Chipset
- Up to 16 GB ECC 1600 MHz DDR3 memory in two SODIMM sockets
- Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
- Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for graphics (or general purpose x8/4/1)
- 2x SATA 6 Gb/s, 2x SATA 3 Gb/s, Gigabit Ethernet, USB 2.0, 4 USB 3.0
- 50% Thicker PCB for high vibration environments
- Extreme Rugged operating temperature: -40 ~ +85°C (optional)
- Express-IBR-i3-R-3217UE - COM Express Basic Type 6 module with dual-core Intel Core i3-3217UE 1.6 GHz CPU and VGA/LVDS/3 x DDI, 1 x GbE, 4 x USB 3.0, 8 x USB 2.0, 2 x SATA-3 with RAID, 2 x SATA-2 with RAID and HD-audio interface (0 ~ +60°C) - ECC DDR3 RAM
- HTS-IBR-B - Heat-spreader for Express-IBR with threaded standoffs for bottom-mounting
- HTS-IBR-BTF - Heat-spreader for Express-IBR with through-hole standoffs for top-mounting
- THSH-IBR-BTL - Passive heatsink for Express-IBR with through hole standoffs for top-mounting
- THSF-IBR-BTL-CU - Heatsink with FAN for Express-IBR with through-hole standoffs for top-mounting
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