Adlink Technology

Bezwentylatorowy komputer do zabudowy z E3845 SoC by LEC-BTS, HDMI, 2x GbE, SDIO, 1x USB3.0, 2x USB, 4x DIO, 2x mPCIe/1x mSATA, 1x USIM. 2GB DDR3L memory down

Bezwentylatorowy komputer do zabudowy z E3845 SoC by LEC-BTS, HDMI, 2x GbE, SDIO, 1x USB3.0, 2x USB, 4x DIO, 2x mPCIe/1x mSATA, 1x USIM. 4GB DDR3L memory down

Bezwentylatorowy komputer do zabudowy z E3826 SoC by LEC-BTS, HDMI, 2x GbE, SDIO, 1x USB3.0, 2x USB, 4x DIO, 2x mPCIe/1x mSATA, 1x USIM. 2GB DDR3L memory down

Rozszerzalny bezwentylatorowy komputer do zabudowy Intel Skylake-H Core i5 CPU+QM170 , 1PCI+2PCIex8,2DP+1DVI-I,3xGbE,6xUSB3.0,4xCOM,16-CH DIO, 1xCfast socket,4x2.5" SATA port,9-32VDC input,16G DDR4

Rozszerzalny bezwentylatorowy komputer do zabudowy Intel Skylake-H Core i3 CPU+QM170 , 1PCI+2PCIex8,2DP+1DVI-I,3xGbE,6xUSB3.0,4xCOM,16-CH DIO, 1xCfast socket,4x2.5" SATA port,9-32VDC input,4G DDR4

Peak Download Rate : 150Mbps Peak Upload Rate : 50Mbps Operating Temp : -40~85°C F/W : RHL75xx.A.2.11.151600.201709111842.x7160

2x2 Wi-Fi + Bluetooth4.1 Module with PCI-e Half-Mini Card IEEE802.11a/b/g/n/ac, PCI-e interface Operating Temperature: 0~70°C Driver for Win7/10, Linux 2pcs x IPEX cables 2pcs x Antenna

SIMCOM7100A LTE full-size mini PCIe card, w/o SIM slot, w/o voice function USB 2.0, 3pcs xIPEX to SMA Cable, 2pcs x4G Antenna, 1pcs xGPS Antenna temperature: -40 to +85℃ AT&T, Canada Rogers

LRM001 module + 1pcs x IPEX cable + 1pcs x Antenna Mini PCI Express form factor Frequency Band: 915MHz RF Output power (maximum) 20dbm Receiver sensitivity: -130 dbm Operation temperature: -30℃~ 75℃ For USA

Core i5-2510E + QM67 VGA+DVI-D, 4x GbE, 4x COM, 4x USB 2.0, 2x USB 3.0 2x mini PCIe, 1x USIM, 1x CFAST, 1x eSATA 9-32Vdc input, 16G Memory.

Intel i3 Embedded I/O platform, Core i3-2330E + QM67, DVI-I, 4x GbE, 4x COM, 4x USB 2.0, 2x USB 3.0 2x mini PCIe, 1x USIM, 1x CFAST, 1x eSATA 9-32Vdc input, 16G DDR3 Memory.

Intel i3 Embedded I/O platform, Core i3-2330E + QM67, DVI-I, 4x GbE, 4x COM, 4x USB 2.0, 2x USB 3.0, 1x CFAST, 1x eSATA, 2x mini PCIe, 1x USIM, 1x SATA 9-32Vdc input, 8G DDR3 SODIMM.

Bezwentylatorowy komputer do zabudowy z Intel HSW i5-4400EQ + QM87, DVI-I + 2xDP, 6x USB3.0, 4x COM, 8DI + 8DO, 1x eSATA, 4x GbE, 2x SATA, 2x mPCIe, 1x USIM, 9-32V DC-IN, 2x 8G DDR3L SODIMM

Optional fan module kit for the MVP-6000 series, fan speed 6,000 rpm, smart fan control

LTE Cat.1 DL10Mbps/UL 5Mbps DC-HSPA+ DL 42Mpbs/UL 5.76Mbps FDD:B1/B3/B5/B7/B28 WCDMA:B1/B5 2pcs x 4G Antenna Operating Temperature: -40~+80°C F/W: EC21AUTFAR02A03M4G For Australia Telstra

Peak Download Rate:100 Mbps. Peak Upload Rate:50 Mbps. For Australia Telstra Operating Temperature:-40°C to +85°C

Peak Download Rate:100 Mbps. Peak Upload Rate:50 Mbps. For Euro, Taiwan Operating Temperature:-40°C to +85°C

GSM EGSM 900/DCS 1800MHz,WCDMA 900/2100 MHz HSPA+,LTE-FDD Babd 1.3.7.8.20,MINI-PEIC LTE Module Peak Download Rate:100 Mbps. Peak Upload Rate:50 Mbps. Operating Temperature: -40~85°C

SIMCOM7100C mPCIe Module + IPEX to SMA Cable + WWAN(4G) ExternalAntenna For use with MXE-100i/110i/200i series w/ IDP.

2x2 Wi-Fi + Bluetooth4.1 Module with PCI-e Half-Mini Card IEEE 802.11a/b/g/n/ac, PCI-e interface Operating Temperature: -10~70℃ Driver for Win/Linux/Android 2pcs x Antenna + 2pcs x IPEX cable

2x2 Wi-Fi + Bluetooth 4.1 Module with PCI-e Half-Mini Card IEEE 802.11a/b/g/n/ac, PCI-e interface Operating Temperature: -40~85℃ Driver for Win/Linux/Android 2pcs x An

Input: 85~264VAC,160W Output: 24VDC/6.67A Frequency: 47~63Hz, Efficiency(Typ.): 93%, Operating Temperature: -30~+70degC, UL/TUV/BSMI//PSE/CE/FCC/CB/CCC/DOE Level 6

Azurewave AW-NB159H WiFi mPCIE Module (v1.2) + Bracket + Cable & screws + ATN. For use with MXE-100i/200i series w/ IDP.

Hot-pluggable fan module for the MXC-4000 series

4G/AGPS mPCIe Module + IPEX to SMA Cable + IPEX to SMA for GPS + 3G Antenna + GPS Antenna, For use with MXE-1300/5300/5400, MXC-2300 series. For US(FCC)/CANADA(IC)/TW(NCC)

MXC-6400 USB kit for internal USB header: USB cable, bracket, screws, 2 sets

Cable:UL20276 28AWG L=1500±10mm CN1 D-SUB 37P*1Path=2.77mm CN2 D-SUB 26P*1Path=2.29mm

WIRE: UL1007,22AWG CN1:LTT H732-04(Pitch2.00) or Equivalent CN2:LTT H719-04(Pitch5.08) or Equivalent L=200 +/-10mm

Pełnowymiarowa karta procesorowa PICMG 1.3 - 4-gen Intel® Core™ i7/i5/i3/Pentium®, Intel® Q87 Express, DDR3 DIMM Dual-Channel, 2x GbE, SATA 6Gb/s, USB 3.0, VGA/DVI-D, PS/2, RAID 0/1/5/1+0, PCI Express, Watchdog Timer, TPM, 0˚C ~ 60˚C

IMB-M43 IMB-M43 ATX Embedded Motherboard supports Intel 6th/7th Generation i7/i5/i3 Processors, 1x PCIe x8, 4x PCIe x4 and 2x PCI slots

IMB-M43 ATX Embedded Motherboard supports Intel 6th/7th Generation E3 Processors, 1x PCIe x8, 4x PCIe x4 and 2x PCI slots

Magistrala pasywna PICMG 1.3 ze złączami 1x PCIe x8 (slot x16), 3x PCIe x4 i 8x PCI

Daughter board for 2-channel Azalia and AC'97 audio output

PCI-E x16 to 1 PC-E x16 & 1 PCI w/.Cable 55m/m PCB (A):125.0mmX64.98mmX1.6mm 4 layer PCB (B):89.14mmX14.80mmX1.6mm 4 layer

PCI-E x16 to 1 PC-E x16 & 2 PCI w/.Cable 150mm PCB (A):190.10 mm X 73.40 mm X 1.6 mm 4 layer PCB (B):115mmX18.64mmX1.6mm 4 layer PCB (C):89.25mmX12mmX1.6mm 4 layer

PCI to 3 x PCI slots w/Cable 150mm PCB (A): 131.40mm X 69.00mm X 1.60mm 2 layer Corresponding direction: Left insert direction

Przemysłowa płyta główna ATX, LGA1151 dla procesorów Intel 6. i 7. generacji i7/i5/i3, 1x PCIex16, 1x PCIex4, 5x PCI, 2x DDR4 2133/2400 MHz do 32GB, 2x Gbit LAN, 4x SATA III, 10x USB, 2x RS232/422/485, 4x RS232 (pinheader), 305 mm x 244 mm

Chassis

2U,RK-260MB Chassis for 2U-S3&2U-E1S2 riser card Color:Black,with Adlink Logo Dimensions (427x88.7x500mm)(WxHxD) Green Part

19" Rack Mount 4U Chassis 430mm*568.9mm*176mm

Include: a.AXI-ATX-21235-G*1pcs b.IO-2F-00700-A *7pcs c.M3,P type,(Ni) *7pcs d.M3,P type,(Black) *7pcs e.ATX Switch *1 pcs f. PSU BKT*1 pcs

for 1U PSU in RK-260MB series chassis Include: 1U PSU holder x1 pcs & PSU Bracket x1 pcs.

1x 2.5" HDD/SSD in a 3.5" adapter bracket Include: 2.5" to 3.5" Adapter Bracket x1 ,Screw #6-32 x4 ,Screw M3 x4

8 slots Wall-mount chassis for Full-size cards, 1B1S+1 Front side 2 USB access,Color:Beige SGCC Change to SECC

Wallmount Chassis for ATX Motherboard Color:Beige

Wallmount Chassis for ATX Motherboard Up Cover w/ Captive Screw Color:Black

RoHS，4U BP Chassis Color:413C

RoHS，4U BP Chassis; Color:Black

Obudowa przemysłowa 4U dla płyty głównej ATX, do szafy RACK 19", biała, RoHS

Obudowa przemysłowa 4U dla płyty głównej ATX, do szafy RACK 19", czarna, RoHS

GH-402 ATX (Black) 19" Rackmount 4U Black Chassis Suppport ATX M/B

Industrial Rackmount 1U Chassis、Black color Green PartsGUANGHSING

Industrial Rackmount 1U Chassis、Black color support PICMG 1.3

Industrial Rackmount 2U Chassis、Black color

Industrial Rackmount,2U Chassis color:Black,56-47025-0010 for NuPro-965. Green Part

Obudowa przemysłowa o wysokości 4U do szaf Rack 19", 14 slotowa pod magistralę pasywną - plater (backplane), beżowa

RK-410FS,Black 19"4U Rackmount Chassis 15-Slot,Color:Black With GHA-410 hold-down bar Carton:64x60x34.5cm

6 slots Wall-mount chassis for Full-size cards, 1B1S+1 Front side 2 USB access,Color:413C

Wire：UL2651 28AWG L=600±10mm With Bracket DB-9pin male to IDC 10P(2.54mm)

APS960XA-EPS12/FSP600-80PSA(9PA6002218)_Std, 600W, AC/ATX Active PFC, Full range input, Support EPS-12V, 80Plus(Bronze), Eup Lot6. UL/CB/TUV/CE/FCC/CCC(China)

Delta_FFB0812SH-F00 Wire length:140±10mm, Pin 1:blue(F00);Pin 2:red(+);Pin 3:black(-);4500RPM

, Cooler Master_ECC-00725-01-GP, SCREW & SPRING、HEATSINK、FAN、RETENTION

DELTA_FHSA9025B-1225, COOLER & RETENTION, for 2U Chassis, 95W(Max) TDP CPU

Heatsink Material : Copper Total Size : 84L*84W*28H(mm) Fan Dimension : 750015 Blower Fan Rated Voltage : 12V DC

LGA2011 2U Cooler Size:89.7×89.7×64.3 mm Inculding : fan,screw,sink....

Holder Bracket for 3.5" to 5.25" DRIVE,ETCH SET HAVE TWO HOLDER BRACKETS,EIGHT SCREWS

Wire：UL2651 28AWG L=230±10mm With Bracket COM(Male)+COM(Male) to IDC 10P(2.0mm)

Wire：UL2651 28AWG L=450±10mm With Bracket COM1 male to IDC 10P(2.0mm)

CABLE:UL2725 28AWG8*1P 24AWG*2C+A+B L=580mm-2PC HOUSING YY-1900H-2*5P-2PC USB A TYPE 4P FEMALE CONN-4PC

CABLE: UL2725 28AWG8*1P 24AWG*2C+AEB L=380mm-2PC HOUSING YY-1900H-2*5P-1PC USB A TYPE 4P FEMALE CONN-2PC

USB+Mini Din 6P BKT---1pc Mini Din 6P cable, UL2464 28AWG---1PC USB cable,UL2725---1PC SCREW---4pcs

For NuPRO-E42 2 Port USB 3.0 With Bracket USB3.0 A Type Female connector,2PCS IDC 2.0 20P right angle,1PCS L=450mm

COM Express type 7 Prototype/Evaluation Board with full size ATX form factor (for Basic and Compact size modules)

COM Express Type7 10GBASE-KR to 10GBASE-T adapter card

SATADOM-SV 3ME3 8GB Flash Type: Toshiba MLC Type: Vertical Interface: SATA III standard(6Gb/s) Sequential: Read:100(MB/s), Write:20(MB/s) Operating Temperature: 0~70°C 39.4*20.5*7.9 mm

Wire:28AWG,L=250+/-10mm, 2*3P(2.54mm)*1,white point on pin2, MINI DIN 6P FEMALE Purple*1, MINI DIN 6P FEMALE Green*1, Bracket STEEL*1, SCREW+NUT*4

Wire:UL20276 28AWG, L=220+/-10mm DVI(24+1P) FEMALE CONNECTOR, HOUSING A2006H-2*10P(PH2.0), BRACKET STEEL*1, SCREW 4#-40UNC*2

Wire:UL21149 26AWG 80℃ L=1000±10mm Color：Red 180°(Latch) to 180°(Latch)

COM Express type 7 10GBASE-KR to SFP+ add-on card, 4 port output

PCIe x16-to-two-x8 adapter card

COM Express Type 6 DDI-to- HDMI/DVI/DisplayPort adapter card

COM Express formfactor starterkit with MiniBase-10R carrier board, power supply, and accessory kit (order COM Express module, LVDS panel and thermal solution separately!)

COM Express formfactor starterkit with Express-BASE6 board, power supply, and accessory kit (order COM Express module,memory and thermal solution separately!)

COM Express formfactor starterkit with Express-BASE7 carrier, 10GbE SFP+ Card, power supply and accessory (order COM Express module, memory and thermal solution separately)

COM Express formfactor starterkit with Express-BASE7 carrier, 10GbE BaseT Card, power supply and accessory (order COM Express module, memory and thermal solution separately)

COM Express formfactor starterkit with Express-BASE7 carrier, 10GbE Full BaseT Card, power supply and accessory (order COM Express module, memory and thermal solution separately)

Express-BASE(L) COM Express Protoype Board with ATX formfactor

Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3930, 2GB DDR3L

Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3950, 4GB DDR3L

Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3950, 8GB DDR3L

, 75mm*45.1mm

LPC Debug Board with secondary BIOS

Multi purpose Debug Board for COM Express

COM Express Type7 10GBASE-KR to 10GBASE-T adapter card, 4 port output

COM Express type 7 10GBASE-KR to SFP+ add-on card

Mini COM Express Type 10 module with Intel Atom E3827 at 1.75 GHz and 2GB non ECC DDR3L,and 8GB eMMC flash storage

Mini COM Express Type 10 module with Intel Atom E3815 at 1.46 GHz and 2GB non ECC DDR3L, and 8GB eMMC flash storage

Mini COM Express Type 10 module with Intel Celeron N2930 at 1.83 GHz and 2GB non ECC DDR3L ,and 8GB eMMC flash storage

Mini COM Express Type 10 module with Intel Celeron J1900 at 2.00 GHz and 2GB non ECC DDR3L, and 8GB eMMC flash storage

Mini COM Express Type 10 module with Intel Atom E3845 at 1.91 GHz and 4GB non ECC DDR3L

Mini COM Express Type 10 module with Intel Atom E3805 at 1.33 GHz and 2GB non ECC DDR3L

Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3950, 2GB DDR3L

Mini COM Express Type10 module with Intel Apollo Lake-I Atom E3940, 2GB DDR3L

Compact COM Express Type6 with Intel Apollo Lake Pentium N4200

Compact COM Express Type6 with Intel Apollo Lake Pentium N3350

Moduł Compact COM Express Type 6 z procesorem Core™ i7-7600U, do 32GB DDR4 Dual-Channel, GbE, 3x SATA III, 4x USB 3.0, 4x USB 2.0, obsługa 3 wyświetlaczy, Temp. pracy 0°C ~ 60°C (opcjonalnie -40°C ~ +85°C)

Moduł Compact COM Express Type 6 z procesorem Core™ i5-7300U, do 32GB DDR4 Dual-Channel, GbE, 3x SATA III, 4x USB 3.0, 4x USB 2.0, obsługa 3 wyświetlaczy, Temp. pracy 0°C ~ 60°C (opcjonalnie -40°C ~ +85°C)

Moduł Compact COM Express Type 6 z procesorem Core™ i3-7100U, do 32GB DDR4 Dual-Channel, GbE, 3x SATA III, 4x USB 3.0, 4x USB 2.0, obsługa 3 wyświetlaczy, Temp. pracy 0°C ~ 60°C (opcjonalnie -40°C ~ +85°C)

Moduł Compact COM Express Type 6 z procesorem Intel Celeron 3965U, do 32GB DDR4 Dual-Channel, GbE, 3x SATA III, 4x USB 3.0, 4x USB 2.0, obsługa 3 wyświetlaczy, Temp. pracy 0°C ~ 60°C (opcjonalnie -40°C ~ +85°C)

Mini COM Express Type 10 module with Intel Atom E3825 at 1.33 GHz and 4GB non ECC DDR3L

Mini size COM Express type 10 module with Intel Atom E3845 at 1.91 GHz and soldered DDR3L and 8GB eMMC flash storage

Mini COM Express Type 10 module with Intel Atom E3825 at 1.33 GHz and 2GB non ECC DDR3L and 8GB eMMCD flash starage

Compact COM Express Type 6 module with Intel Celeron 3955U with GT1 level graphics

Compact COM Express Type6 with Intel Apollo Lake-I Atom E3950

Compact size type6 COM Express module with Intel Apollo Lake-I E3950, 32GB eMMC

Compact COM Express Type6 with Intel Apollo Lake-I Atom E3940

Compact size type6 COM Express module with Intel Apollo Lake-I E3940, 16GB eMMC

Compact COM Express Type6 with Intel Apollo Lake-I Atom E3930

Compact size type6 COM Express module with Intel Apollo Lake-I E3930, 8GB eMMC

Compact COM Express Type 6 module with Intel i7-6600U with GT2 level graphics